Shenzhen KLD was established in 2013. It is a technology-based company focusing on the research, development, production of semiconductor components circuit interface testing and FPC connection testing solutions.
The elites of the company come from Emerson's power R&D, testing, and engineering departments. They have more than 15 years of engineering and technical capabilities and have strong electronic circuit development, software development, mechanical 3D design and system integration capabilities.
KLD company adheres to the service concept of "Quality, Technology, Innovation, Win-win", continuously innovates technology and upgrades products to provide customers with more advanced and efficient testing solutions.
Main products and services:
■ One-Stop ATE Test Sockets & Kits
■ AI/GPU/Automotive etc Chip Burn-in Test Sockets
■ Chip Burn-in Boards
■ Energy-Saving Burn-in Cabinets for Module Power Supplies
■ Customized ATE Test Solutions for Power Supply Chips
■ RF Test Sockets
■ Coaxial Test Sockets
■ FPC Micro-Needle Module Test Solutions
KLD products are widely used in performance testing, functional testing, mass production aging testing of chips such as semiconductors, network digital energy, xEV, big data centers, aerospace, military and high-power AI.
KLD Development Milestone
2025 Vehicle-grade Burn in Sockets are used in OSAT in large quantities
2024 RF test solution experts joined in KLD team
2024 Sub-brand "FCS Precision" focuses on module power aging solutions
2024 module power mass production aging chamber with temperature measurement module
2023 module power function automation test production line
2022 module power ATE test system
2021 Research Institute B module power aging mass production aging equipment
2020 Research Institute A chip-level module power test socket
2019 ATE Socket&Kit is used in OSAT
2017 iPhone X AP + RF upper and lower layer B2B test fixture
2017 iPhone 6/6P LPDDR/SoC + Nand + EEPROM kit test fixture
2016 LG/Samsung CPU + Nand kit test fixture
2015 iPhone 5S baseband + Nand Flash +EEPROM chip kit test fixture
2015 Huawei P6/P7/Maroc/Honor/Mate mobile phone CPU, PMU test fixture
2014 SanDisk chip test socket and assist engineering soldering
2013 Broadcom set-top box, router, Wifi and other chip test fixtures